Interconnect array pattern with a 3:1 signal-to-ground ratio

ABSTRACT

An electronic device including a plurality of interconnects are orthogonally arranged in a grid pattern and evenly spaced by a first distance, the plurality of interconnects include: a first conductor pair with conductors arranged next to each other in a first direction, the first direction is oriented diagonally relative to the orthogonal grid pattern, a second conductor pair with conductors arranged next to each other in a second direction substantially perpendicular to the first direction, each conductor of the second conductor pair is spaced by the first distance from each signal conductor of the first conductor pair, and a third conductor pair with conductors arranged next to each other in a third direction substantially parallel to the first direction, each conductors of the third conductor pair is spaced by the first distance from one of the signal elements of the second conductor pair.

BACKGROUND

The present invention generally relates to electrical interconnects inintegrated circuits, and more particularly to minimizing signalcrosstalk using an interconnect array pattern with a 3:1signal-to-ground ratio.

Signals may be transmitted in data processing systems using techniquessuch as signal-ended signaling and differential signaling. A signal isany data capable of transmission, for example, an electromagnetic fieldof electric current used to propagate data in a medium. Differentialsignaling, which uses differential transmission lines to transmit asignal, is often preferred in applications that require an extra degreeof noise immunity.

A differential transmission line is a plurality of electrical conductorsthat complement one another in the transmission of a signal. The signaltransmitted by the differential transmission line is indicated by avoltage difference between the conductors of the differentialtransmission line. For example, a differential transmission line mayinclude two wires that are substantially parallel to one another, andwhich transmit a signal as indicated by a voltage difference between thetwo wires. Any noise source that induces more voltage on one conductorthan the other will add a net noise in the signal that is equal to thedifference in noise between the conductors.

Differential signaling may be used in different contexts. For example,differential signaling may be used in computers, circuits, computernetworks, data transmission connectors, cables, power grids, low voltageapplications, high voltage applications, low frequency application, andhigh frequency applications.

Differential signaling may be used in analog signaling, such as theanalog signaling used in some audio and video systems. Differentialsignaling may also be used in digital signaling. For example,differential signaling is used in the EIA-422 and EIA-485 specificationsfor signaling. EIA-422 is the technical standard that specifies theelectrical characteristics of the balanced voltage digital interfacecircuit. EIA-485 is an open system interconnection model physical layerelectrical specification of a two-wire, half-duplex, multi-point serialconnection. EIA-422 and EIA-485 are now administered by theTelecommunications Industry Association. Other exemplary uses ofdifferential signaling in digital signaling include the use ofdifferential signaling in the peripheral component interconnect express(PCI Express) and universal serial bus interface types.

Differential signaling may also be used in the high-speed digital serialinterfaces of low voltage differential signaling, serial advancedtechnology attachment (Serial ATA), hypertransport, and Ethernet. Otherimplementations of differential signaling may be found in emittercoupled logic (ECL), positive emitter coupled logic (PECL), low voltagepositive emitter coupled logic (LVPECL), musical instrument digitalinterface (MIDI), transition minimized differential signaling, andfirewire.

SUMMARY

According to an embodiment of the present invention, an electronicdevice is provided. The electronic device may include at least one layerforming a plane and having a plurality of interconnects passing throughat least a portion of the layer; each of the plurality of interconnectshaving a longitudinal axis substantially perpendicular to the plane, theplurality of interconnects are orthogonally arranged in a grid patternand evenly spaced by a first distance, the plurality of interconnectsinclude: a first differentially driven signal conductor pair withconductors arranged next to each other in a first direction, the firstdirection is oriented diagonally relative to the orthogonal gridpattern, a second differentially driven signal conductor pair withconductors arranged next to each other in a second directionsubstantially perpendicular to the first direction, each conductor ofthe second differentially driven signal conductor pair is spaced by thefirst distance from each signal conductor of the first differentiallydriven signal conductor pair, and a third differentially driven signalconductor pair with conductors arranged next to each other in a thirddirection substantially parallel to the first direction, each conductorsof the third differentially driven signal conductor pair is spaced bythe first distance from one of the signal conductors of the seconddifferentially driven signal conductor pair.

According to another embodiment of the present embodiment, interconnectarray pattern is provided. The interconnect array pattern may include aplurality of signal elements and a plurality of power/ground elementsevenly spaced by a first distance and orthogonally arranged in a gridpattern, a first differentially driven signal conductor pair includingtwo of the plurality of signal elements arranged next to each other andspaced apart by a second distance in a first direction, the firstdirection is oriented diagonally relative to the orthogonal gridpattern, a second differentially driven signal conductor pair includingtwo of the plurality of signal elements arranged next to each other andspaced apart by the second distance in a second direction substantiallyperpendicular to the first direction, each signal element of the seconddifferentially driven signal conductor pair is spaced by the firstdistance from each signal element of the first differentially drivensignal conductor pair, and a third differentially driven signalconductor pair including two of the plurality of signal elementsarranged next to each other and spaced apart by the second distance in athird direction substantially parallel to the first direction, eachsignal element of the third differentially driven signal conductor pairis spaced by the first distance from one of the signal elements of thesecond differentially driven signal conductor pair, where thepower/ground elements are arranged in a single row diagonally across theorthogonal grid pattern such that the plurality of power/ground elementsare spaced apart from each other by the second distance in the seconddirection.

According to another embodiment of the present embodiment, an electronicdevice is provided. The electronic device may include a plurality ofsignal elements and a plurality of power/ground elements evenly spacedby a first distance and orthogonally arranged in a grid pattern, wherethe plurality of signal elements and the plurality of power/groundelements are arranged into rows and columns of the orthogonal gridpattern, each row of the orthogonal grid pattern includes a repeatingpattern of three signal elements and a single ground element, wheresuccessive sets of three signal elements are separated along the row bya single ground element, the repeating pattern of conductors in each rowis offset by one column and repeated in successive rows, creating threediagonal rows of signal elements followed by a single diagonal row ofground elements.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

The following detailed description, given by way of example and notintended to limit the invention solely thereto, will best be appreciatedin conjunction with the accompanying drawings, in which:

FIG. 1 is a perspective view of differential transmission lines;

FIG. 2 is a cross-sectional view of a differential transmission line onwhich the illustrative embodiments may be implemented;

FIG. 3 is a cross-sectional view of an interconnect array pattern inaccordance with an exemplary embodiment;

FIG. 4 is a cross-sectional view of the interconnect array patternrepeated in accordance with an exemplary embodiment;

FIG. 5 is a cross-sectional view of the interconnect array pattern whichillustrates crosstalk for select elements of the interconnect arraypattern in accordance with an exemplary embodiment;

FIG. 6 is a cross-sectional view of the interconnect array pattern whichillustrates crosstalk for all elements of the interconnect array patternin accordance with an exemplary embodiment;

FIG. 7 is a functional block diagram illustrating a system for circuitdesign, circuit modeling, or circuit diagnostics in a networked computerenvironment in accordance with an exemplary embodiment;

FIG. 8 is a functional block diagram of components of a server computerexecuting the circuit design modeling program or diagnostic program inaccordance with an exemplary embodiment; and

FIG. 9 is a flow diagram of a design process used in semiconductordesign, manufacture, and/or test in accordance with an exemplaryembodiment.

The drawings are not necessarily to scale. The drawings are merelyschematic representations, not intended to portray specific parametersof the invention. The drawings are intended to depict only typicalembodiments of the invention. In the drawings, like numbering representslike elements.

DETAILED DESCRIPTION

Detailed embodiments of the claimed structures and methods are disclosedherein; however, it can be understood that the disclosed embodiments aremerely illustrative of the claimed structures and methods that may beembodied in various forms. This invention may, however, be embodied inmany different forms and should not be construed as limited to theexemplary embodiments set forth herein. Rather, these exemplaryembodiments are provided so that this disclosure will be thorough andcomplete and will fully convey the scope of this invention to thoseskilled in the art. In the description, details of well-known featuresand techniques may be omitted to avoid unnecessarily obscuring thepresented embodiments.

References in the specification to “an embodiment”, “an embodiment”, “anexample embodiment”, etc., indicate that the embodiment described mayinclude a particular feature, structure, or characteristic, but everyembodiment may not necessarily include the particular feature,structure, or characteristic. Moreover, such phrases are not necessarilyreferring to the same embodiment. Further, when a particular feature,structure, or characteristic is described in connection with anembodiment, it is submitted that it is within the knowledge of oneskilled in the art to affect such feature, structure, or characteristicin connection with other embodiments whether or not explicitlydescribed.

For purposes of the description hereinafter, the terms “upper”, “lower”,“right”, “left”, “vertical”, “horizontal”, “top”, “bottom”, andderivatives thereof shall relate to the disclosed structures andmethods, as oriented in the drawing figures. The terms “overlying”,“atop”, “on top”, “positioned on” or “positioned atop” mean that a firstelement, such as a first structure, is present on a second element, suchas a second structure, wherein intervening elements, such as aninterface structure may be present between the first element and thesecond element. The term “direct contact” means that a first element,such as a first structure, and a second element, such as a secondstructure, are connected without any intermediary conducting, insulatingor semiconductor layers at the interface of the two elements.

In the interest of not obscuring the presentation of embodiments of thepresent invention, in the following detailed description, someprocessing steps or operations that are known in the art may have beencombined together for presentation and for illustration purposes and insome instances may have not been described in detail. In otherinstances, some processing steps or operations that are known in the artmay not be described at all. It should be understood that the followingdescription is rather focused on the distinctive features or elements ofvarious embodiments of the present invention.

In high-speed electronic package and printed circuit board design,interconnect arrays are widely used. The total number of array elementsin an array is limited by the interface area and the pitch or density ofthe interconnect array. In an embodiment, the interconnect array mayinclude a vertical array including elements, such as, for example,balls, pins, or vias. The array elements may be divided into two groups,the signal group and the power/ground group. The power/ground elementsprovide not only the power supply, but also the return path to signalchannel and the shielding between signal channels. In most designs, alarge signal-to-ground ratio in the array is preferred to make full useof the limited number of the array elements. However, too large of asignal-to-ground ratio will result in poor signal return path(especially in single ended application) and less shielding betweensignal channels (in both single-ended and differential applications).

The present invention generally relates to electrical interconnects inintegrated circuits, and more particularly to minimizing signalcrosstalk using an interconnect array pattern with a 3:1signal-to-ground ratio. One way to use the interconnect array patternwith a 3:1 signal-to-ground ratio to minimize differential crosstalk mayinclude using a unique orthogonal pair interconnect pattern. Anembodiment by which to minimize differential crosstalk using theinterconnect array pattern with a 3:1 signal-to-ground ratio isdescribed in detail below with reference to FIGS. 1-6.

The illustrative embodiments described herein provide an apparatus andmethod for facilitating signal transmission using differentialtransmission lines organized according to a diagonal interconnectpattern. The diagonal interconnect pattern includes a plurality ofsignal elements and a plurality of power/ground elements. In anembodiment, the plurality of signal elements and the plurality ofpower/ground elements of the diagonal interconnect pattern areorthogonally arranged in a grid having rows and columns. Each row of thegrid includes a repeating pattern of three signal elements and a singleground element, where successive sets of three signal elements areseparated along the row by a single power/ground element. The repeatingpattern of each row is offset by one column and repeated in successiverows, creating three diagonal rows of signal elements followed by asingle diagonal row of power/ground elements. The diagonal interconnectpattern includes a 3:1 signal-to-ground ratio. The diagonal interconnectpattern of this embodiment is fully repeatable in either direction,across successive row, across successive columns, or both. Because allelements of the diagonal interconnect pattern are arranging in a grid,each element is equidistant from all adjacent elements. In anembodiment, the signal elements of the diagonal interconnect pattern maybe assigned as differential pairs in which the nearby power/groundelement offer some shielding against crosstalk.

In an embodiment, the apparatus includes a first differentialtransmission line. The first differential transmission line includes afirst plurality of conductors. The first plurality of conductorsincludes a first conductor and a second conductor. A conductor is anymaterial capable of conducting electricity. The apparatus also includesa second differential transmission line. The second differentialtransmission line includes a second plurality of conductors. The secondplurality of conductors includes a third conductor and a fourthconductor. The apparatus further includes a third differentialtransmission line. The third differential transmission line includes athird plurality of conductors. The third plurality of conductorsincludes a fifth conductor and a sixth conductor.

In an embodiment, a first noise produced by the first conductor of thefirst plurality of conductors is balanced by a second noise produced bythe second conductor of the first plurality of conductors. A third noiseproduced by the third conductor of the second plurality of conductors isbalanced by a fourth noise produced by the fourth conductor of thesecond plurality of conductors. A fifth noise produced by the fifthconductor of the third plurality of conductors is balanced by a sixthnoise produced by the sixth conductor of the third plurality ofconductors. A noise is any effect on the set of conductors caused by atleast one of the second plurality of conductors. For example, a noisemay be a voltage aberration on the set of conductors caused by at leastone of the second plurality of conductors.

The first noise and the second noise are “balanced” if the first noiseand second noise cause no change in the original signal carried by thefirst differential transmission line that would change a device'sinterpretation of the original signal. The same is true for both thesecond differential transmission line and the third differentialtransmission line. As used in these examples, an interpretation is anymeaning or representation attributed to the original signal. The deviceis any device capable of detecting a difference between two conductorsin a differential transmission line, such as an oscilloscope, bit errorrate tester, or differential receiver circuit. In another embodiment,the first noise and the second noise are “balanced” if a signal carriedby the first differential transmission line is changed by less than apredefined threshold amount.

In an embodiment, a the first noise produced by the first conductor onthe first plurality of conductors is balanced by the second noiseproduced by the second conductor on the first plurality of conductors ifa negligible amount of net noise is produced by the first conductor andthe second conductor on the first plurality of conductors. Again, thesame is true for both the second plurality of conductors and the thirdplurality of conductors. Net noise is the cumulative effect of the firstnoise and the second noise on the set of conductors. A negligible amountof net noise is an amount of net noise that causes no change in theoriginal signal carried by the first differential transmission line thatwould change a device's interpretation of the original signal. Inanother embodiment, a negligible amount of net noise is a predefinedthreshold amount of noise. In one example, the negligible amount of netnoise is zero.

In another embodiment, the first plurality of conductors defines a firstaxis and the second plurality of conductors defines a second axis. Inthis embodiment, the first axis forms an angle with the second axis. Inone example, the angle is approximately ninety degrees. “Approximately”means that the angle's deviation from ninety degrees is too slight tocause a change in a device's interpretation of the original signalcarried by the first differential transmission line. In another example,“approximately” means that the angle's deviation from ninety degree isless than a predefined threshold amount. In this embodiment, the firstaxis intersect the second axis at or near its midpoint. Similarly, thesecond axis intersects the first axis at or near its midpoint.

In another embodiment, the third plurality of conductors defines a thirdaxis. The third axis is substantially perpendicular to, but does notintersect, the first axis and substantially parallel to the second axis.Again, “substantially” means that the third axis' deviation from beingperpendicular to the first axis is too slight to cause a change in adevice's interpretation of the original signal carried by the firstdifferential transmission line. In another example, “substantially”means that the third axis' deviation from being perpendicular is lessthan a predefined threshold amount.

In an embodiment, the first differential transmission line is locatedalong the line of symmetry of the second differential transmission line,and the second differential transmission line is located along the lineof symmetry of the first differential transmission line. Furthermore,the second differential transmission line is located along the line ofsymmetry of the third differential transmission line.

In general, the line of symmetry of the first differential transmissionline dissects the first axis; the line of symmetry of the seconddifferential transmission line dissects the second axis; and the line ofsymmetry of the third differential transmission line dissects the thirdaxis. In an embodiment, the line of symmetry of the third differentialtransmission line dissects the first axis of the first differentialtransmission line, and the line of symmetry of the first differentialtransmission line dissects the third axis of the third differentialtransmission line.

In an embodiment, a fifth noise produced by the fifth conductor on thefourth conductor of the second plurality of conductors is balanced by asixth noise produced by the sixth conductor on the second conductor ofthe second plurality of conductors if a negligible amount of net noiseis produced by the fifth conductor and the sixth conductor of the thirdplurality of conductors. Net noise is the cumulative effect of the fifthnoise and the sixth noise on the second plurality of conductors. Anegligible amount of net noise is an amount of net noise that causes nochange in the original signal carried by the second differentialtransmission line that would change a device's interpretation of theoriginal signal. In another embodiment, a negligible amount of net noiseis a predefined threshold amount of noise. In one example, thenegligible amount of net noise is zero.

Referring now to FIG. 1, a perspective view of a differentialtransmission line is shown. Specifically, FIG. 1 shows differentialtransmission line 102, which may be implemented in accordance with theillustrative embodiments.

The differential transmission line 102 includes conductors 104 and 106.The conductors 104 and 106 may be components of a circuit or circuitsand include, among other structures, lines and vias in printed circuitboards, electronic packages, integrated circuits, cables, connectors orother devices. The conductors 104 and 106 may pass through at least aportion of a layer of a printed circuit board, electronic package,integrated circuit, or other device to form the designed electricalconnection. The conductors 104 and 106 may also be referred to as a“trace” or a “phase” of the differential transmission line 102. Theconductors 104 and 106 may be composed of any conductive material. Forexample, the conductors 104 and 106 may be composed of copper, silver,aluminum, gold, nickel, molybdenum, tungsten, or any combinationthereof.

The differential transmission line 102 transmits a signal. In onenon-limiting example, the signal may be obtained by measuring a voltagedifference 108 between conductors 104 and 106. In this example, thevoltage difference 108 may be measured by any device, such as anoscilloscope, bit error rate tester, or differential receiver circuit.

In one non-limiting example of a signal that may be transmitted by thedifferential transmission line 102, the differential transmission line102 may transmit either a high-logic state signal, such as “1”, orlow-logic state signal, such as “0”. A high-logic state signal, in oneexample, may be present when the conductor 104 has a predefined non-zerovoltage V_(s) and the conductor 106 has a voltage of zero. A low-logicstate signal, in one example, may be present when the conductor 104 hasa voltage of zero and the conductor 106 has a predefined non-zerovoltage V_(s). The differential transmission line 102 may be used tosend any type of signal, which may be obtained or interpreted bymeasuring the voltage difference 108. Non-limiting examples of signalsthat may be transmitted include digital logic signals, analog basebandsignals, or modulated carrier signals. Examples of modulated carriersignals include, among others, frequency modulated signals, amplitudemodulated signals, phase modulated signals, and single sideband signals.

Noise may be introduced onto any of the conductors 104 and 106 by anyoutside source capable of producing electromagnetic emissions, such asother differential transmission lines. In the case in which thedifferential transmission line 102 transmits a high-logic state signalor low-logic state signal, the presence of another differentialtransmission line may introduce noise onto any one of the conductors 104and 106. In fact, the presence of another differential transmission linethreatens the integrity of the original signal transmitted by thedifferential transmission line 102. For example, because the voltagedifference between the high-logic state and the low-logic state is V_(s)times two (2V_(s)), any noise caused by the presence of anotherdifferential transmission line that exceeds 2V_(s) results in a changedinterpretation of the original signal by any device measuring thevoltage difference 108. In a more specific example, in the case in whichthe differential transmission line 102 transmits a low-logic statesignal, a noise that is greater than 2V_(s) on either or both of theconductors 104 and 106 may result in the failure of a measuring deviceto interpret the voltage difference 108 as a low-logic state signal.

In another example, the conductors 104 and 106 may be balanced orunbalanced lines. In the example in which the conductors 104 and 106 arebalanced lines, each of the conductors 104 and 106 have equal impedanceto ground or other circuits. A balanced line reduces noise on theconductors 104 and 106 by rejecting common-mode interference.

Referring now to FIG. 2, a cross-sectional view of a differentialtransmission line on which the illustrative embodiments may beimplemented is shown. Specifically, FIG. 2 shows a cross-sectional viewof the differential transmission line 102 of FIG. 1 as indicated bycross-sectional line A-A.

The conductors 104 and 106 may have any shape. As shown, the conductors104 and 106 have a circular cross-sectional shape. However, theconductors 104 and 106 may also have a cross-sectional shape that is asquare, rectangle, ellipse, triangle, or any polygon.

The differential transmission line 102 includes the conductors 104 and106, which are separated by a distance 202. The conductors 104 and 106define an axis 204, which is the shortest distance connecting theconductors 104 and 106.

FIG. 2 also shows an isolation distance 206. The isolation distance 206is the smallest distance between the conductor 106 and anotherelectromagnetic source, such as another differential transmission line,at which a negligible amount of noise is introduced on conductor 106.Hence, if a conductor from another differential transmission line ispresent in an area 208, non-negligible amounts of noise will beintroduced onto the conductor 106. In an embodiment, the isolationdistance 206 is larger than the distance 202 such that the noisecoupling is minimized between conductors 104 and 106.

A line of symmetry 210 dissects the axis 204. The line of symmetry 210is also perpendicular to the axis 204. The line of symmetry 210 mayintersect the axis 204 at the midpoint of the axis 204. Alternatively,the line of symmetry 210 may intersect the axis 204 at any point alongaxis 204.

In one example, external signal induction that equally affects theconductors 104 and 106 will be rejected. Hence, one or more signaltraces, conductors, pins, or vias that are positioned along the line ofsymmetry 210 will be at the same distance from both of the conductors104 and 106, and will induce the same amount of noise on each of theconductors 104 and 106. Thus, the induced noise will be ignored.

Referring now to FIG. 3, a cross-sectional view of an interconnect arraypattern 300 is shown in accordance with an embodiment. Morespecifically, the interconnect array pattern 300 includes a plurality ofdifferential transmission lines organized and arranged in a unique,fully repeatable, pattern which maximizes array element density acrossan interface area and reduces cross-talk between adjacent differentialtransmission lines. One or all of the differential transmission lines ofthe interconnect array pattern 300 may be substantially similar to thedifferential transmission line 102 described above with reference toFIGS. 1 and 2.

The array elements of the interconnect array pattern 300 are dividedinto two groups, a signal group and a power/ground group. Thepower/ground elements provide not only the power supply, but also thereturn path to signal elements and the shielding between signalelements. In general, signal elements are paired together to createdifferential transmission lines, and each signal element of adifferential transmission line may be referred to as a conductor, asabove. As indicated by the key of FIG. 3, the signal elements of theinterconnect array pattern 300 are identified by a number, and thepower/ground elements are cross-hatched and are not identified by anumber. Like the signal elements the power/ground elements may also becomponents of a circuit or circuits and include, among other structures,lines and vias in printed circuit boards, electronic packages,integrated circuits, cables, connectors or other devices. Also like thesignal elements, the power/ground elements may pass through at least aportion of a layer of a printed circuit board, electronic package,integrated circuit, or other device to form the designed electricalconnection.

In the present embodiment, the interconnect array pattern 300 uses aparticular orthogonal differential pair pattern to minimize thedifferential crosstalk in differential interconnect array, for example avia array of a package and printed circuit board.

The signal elements of the interconnect array pattern 300 may bearranged in a cross or diagonal pattern. A diagonal pattern ofdifferential transmission lines, such as that of the interconnect arraypattern 300, may allow for an increased density of differentialtransmission lines per unit area. The power/ground elements of thepattern 300 are symmetrically disposed relative to the signal elements.In general, all of the elements of the interconnect array pattern 300may be spaced in an orthogonal or grid fashion with a common pitch inboth the x and y directions. Further, the pitch in the x direction (xpitch) may be substantially equal to the pitch in the y direction (ypitch). In general, the pitch between elements may range from about 0.6mm to about 2.0 mm on a printed circuit board, and from about 5 nm toabout 250 nm on a chip. The interconnect array pattern 300 of thepresent embodiment offers two distinct advantages (1) a 3:1signal-to-ground ratio which achieves efficient use of limited arrayelement space; and (2) the pattern 300 is fully repeatable for ease ofpackage and printed circuit design. Additionally, the orthogonalconfiguration of the interconnect array pattern 300 works to minimize oreliminate crosstalk between elements.

More specifically, the interconnect array pattern 300 of the presentembodiment includes differential transmission lines 302, 304, 306, 308,310, 312, 314, and 316 and surrounding ground elements in the diagonalpattern. One or more signals may be transmitted using differentialtransmission lines 302, 304, 306, 308, 310, 312, 314, and 316. Thedifferential transmission lines 302, 304, 306, 308, 310, 312, 314, and316 are non-limiting examples of the differential transmission line 102of FIGS. 1 and 2. For example, the differential transmission lines 302,304, 306, 308, 310, 312, 314, and 316, each includes conductors 1 and 2;3 and 4; 5 and 6; 7 and 8; 9 and 10; 11 and 12; 13 and 14; and 15 and16, respectively. Each of the differential transmission lines 302, 304,306, 308, 310, 312, 314, and 316, are identified in the figure by anelliptical ring surrounding each differential pair of conductors. Thedifferential transmission lines of the interconnect array pattern 300may alternatively be referred to as differential pairs. Further, thedifferential transmission lines 302, 304, 306, 308, 310, 312, 314, and316, each define an axis 320, 322, 324, 326, 328, 330, 332, and 334,respectively. In addition to the diagonal pattern, the interconnectarray pattern 300 may be referred to as an orthogonal differential pairpattern in which differential pairs of conductors, for example 302, 304,306, 308, 310, 312, 314, and 316, are organized orthogonally withrespect to one another in order to minimize or eliminate crosstalk.

It should be noted that additional differential transmission lines andground elements are depicted; however the below discussion will beprimarily directed to the differential transmission lines 302, 304, 306,308, 310, 312, 314, and 316. While the follow description is focused onthe differential transmission lines 302, 304, 306, 308, 310, 312, 314,and 316, the same will be understood to apply equally to the entireinterconnect array pattern 300, including any and all differentialtransmission lines not specifically referenced or illustrated. The sameapplies to any and all ground elements.

Differential transmission lines 302, 308, and 314 each have the sameorientation because each of these differential transmission lines haveaxes that lie in the same directional plane. The distance between anytwo adjacent conductors of differential transmission lines 302, 308, and314 of the present embodiment may be solved using Pythagorean's Theoremdue to the fact that all elements in the interconnect array pattern 300are arranged in an orthogonal pattern. For example, if the pitch isequal to 1, conductor 2 of differential transmission line 302 isseparated from conductors 1 and 7 by a distance equal to approximately1.4.

Similarly, differential transmission lines 304, 306, 310, 312, and 316each have the same orientation because each of these differentialtransmission lines have axes that lie in the same directional plane.Stated differently, the distance between any two adjacent conductors ofdifferential transmission lines 304, 306, 310, 312, and 316 of thepresent embodiment may also be solved using Pythagorean's Theorem due tothe fact that all elements in the interconnect array pattern 300 arearranged in an orthogonal pattern. For example, if the pitch is equal to1, conductors 3 and 4 of differential transmission line 304 areseparated by a distance equal to approximately 1.4. The same is true forconductors 5 and 6, 9 and 10, 11 and 12, and 15 and 16. Further, forexample, if the pitch is equal to 1, conductor 3 of differentialtransmission line 304 is separated from conductor 5 of differentialtransmission line 306 by a distance equal to approximately 1.4. Thedistance between any two adjacent conductors of differentialtransmission lines 304, 306, 310, 312, and 316 of the present embodimentmay also be solved using Pythagorean's Theorem.

In an embodiment, axes 320, 326, and 332 are perpendicular to axes 322,324, 328, 330, and 334. In another embodiment, the direction along whichaxes 320, 326, and 332 lie is oriented approximately ninety degrees fromthe direction along which axes 322 324, 328, 330, and 334 lie. Also,axes 320, 326, and 332 intersect axes 322, 328, and 334 at or near theirmidpoints, respectively.

In an embodiment, axis 320 forms an angle with axis 322. In one example,the angle is approximately ninety degrees. In this embodiment, axis 320intersects axis 322 at or near its midpoint. Similarly, axis 322intersects axis 320 at or near its midpoint. In another embodiment, axis324 is substantially perpendicular to, but does not intersect, axis 320and substantially parallel to axis 322. In an embodiment, differentialtransmission line 302 is located along a line of symmetry ofdifferential transmission line 304, and differential transmission line304 is located along a line of symmetry of differential transmissionline 302. Furthermore, differential transmission line 302 is alsolocated along a line of symmetry of differential transmission line 306.

In general, the line of symmetry of differential transmission line 302dissects axis 320; the line of symmetry of differential transmissionline 304 dissects axis 322; and the line of symmetry of differentialtransmission line 306 dissects axis 324. In an embodiment, the line ofsymmetry of differential transmission line 306 dissects axis 322 ofdifferential transmission line 304, and the line of symmetry ofdifferential transmission line 304 dissects axis 324 of differentialtransmission line 306.

In one embodiment, differential transmission line 304 is positionedbetween conductors 1 and 2 of differential transmission line 302,differential transmission line 310 is positioned between conductors 7and conductor 8 of differential transmission line 308, and differentialtransmission line 316 is positioned between conductors 13 and conductor14 of differential transmission line 314. Differential transmission line306 is perpendicular to and positioned between differential transmissionlines 302 and 308, and differential transmission line 312 isperpendicular to and positioned between differential transmission lines308 and 314. As described above, each row of the interconnect arraypattern 300 includes a repeating pattern of three signal elementsseparated by a single power/ground element.

In an embodiment, differential transmission lines 302, 304, 306, 308,310, 312, 314, and 316 facilitate signal transmission using vias. A viais a plated hole that connects conductors from one layer of a circuitboard to conductors from another layer of the circuit board.Alternatively, differential transmission lines 302, 304, 306, 308, 310,312, 314, and 316 may be used to facilitate signal transmission betweenany components of a circuit board.

In an embodiment, differential transmission lines 302, 304, 306, 308,310, 312, 314, and 316 facilitate signal transmission in a pinarrangement. Pins are connecting interfaces between computing devices.For examples, plug-in connectors for computers often include pinarrangements, which facilitate communication to and from an externaldevice.

Referring now to FIG. 4, the proposed interconnect array pattern isshown after being repeated in an x direction. The interconnect arraypattern 300 is fully repeatable in both the x and y directions whilemaintaining a 3:1 signal-to-ground ratio. Furthermore, the interconnectarray pattern 300 allows for complete use of every element in thepattern which translates to increased element density and more efficientused of available interconnect area. The repeatability of theinterconnect array pattern 300 extends the local signal density to alarger area while the overall signal density remains the same as thelocal signal density.

Referring now to FIGS. 5 and 6, the differential crosstalk cancellationof the interconnect array pattern 300 is shown. More specifically, thedifferential crosstalk cancellation with respect to certain pairs ofelements within the interconnect array pattern 300 is depicted in FIG.5, and the differential crosstalk cancellation with respect to allelements within the interconnect array pattern 300 is depicted in FIG.6.

With specific reference to FIG. 5, in general, complete or near completecancellation of crosstalk may be achieved for differential applicationsfor all elements of the interconnect array pattern 300 spaced a distanceof 1.0 pitch from one another. These scenarios are illustrated in thefigure with solid black arrows.

For example, conductor 5 will have an opposite signal sign fromconductor 6 because they are two legs of the same differential pair.Therefore, the crosstalk from conductor 5 to conductor 2 will cancel thecrosstalk from conductor 6 to conductor 2. Similarly the reverse istrue, for example the crosstalk from conductor 8 to conductor 11 cancelsthe crosstalk from conductor 8 to conductor 12

In an embodiment, a first noise produced by conductor 5 on conductor 2is balanced by a second noise produced by conductor 6 on conductor 2.The first noise and the second noise are “balanced” if the first noiseand second noise cause no change in a signal carried by differentialtransmission line 302 that would change a device's interpretation of thesignal. An interpretation is any meaning or representation attributed tothe signal. For example, assuming that a device interprets a voltagedifferential of six volts as a ‘1’, in the case in which thedifferential transmission line 302 has a voltage differential of sixvolts, the first noise and the second noise are balanced if the deviceinterprets the voltage differential as a ‘1’. In this example, if thedevice interprets the voltage differential as anything other than ‘1’,such as ‘0’, then the first noise and the second noise are unbalanced.

In another embodiment, a negligible amount of net noise is produced byconductors 1 and 2 on either or both of conductors 1 or 2. For example,the negligible amount of net noise on either or both of conductors 1 or2 may be zero or approximately zero. Further, in an embodiment, the netnoise on conductor 1 may generally match the net noise on conductor 2.In such case, because conductors 3 and 4 are located at the samedistance from both of conductors 1 and 2, conductors 3 and 4 produce thesame amount of noise on each of conductors 1 and 2. Because eachconductor 1 and 2 is affected equally, the noise will be ignored duringa differential signal measurement.

The power/ground elements provide shielding between differential pairs(reducing inter-pair crosstalk) and reducing the effects by unwantedcommon mode. More power/ground elements will result in better signalintegrity quality, but result in lower signal element density in aparticular interconnect array pattern. An appropriate signal-to-groundratio such as 1:1, 2:1, 3:1, 4:1, etc. may be selected based on theparticular application.

With specific reference to FIG. 6, the differential crosstalkcancellation with respect to all elements within the interconnect arraypattern 300 is shown. In short, crosstalk or noise will effectively becompletely canceled between all array elements spaced a distance of 1.0pitch from each other for differential signaling or differential modeapplications. Meanwhile all crosstalk or noise from the array elementsspaced a distance of 1.4 pitch still have some effect on adjacentelements for differential mode applications. It should be noted,however, the crosstalk or noise from array elements spaced a distance of1.4 pitch are much smaller than those array elements spaced a distanceof 1.0 pitch.

The illustrative embodiments show differential transmission lines thatfacilitate signal transmission and increase the density of thedifferential transmission lines for a particular area. Normally, whenmultiple differential transmission lines are wired together, typicallyas part of a high-speed bus, the differential transmission lines need tobe spaced apart from each other in order to minimize inter signal noisecoupling. However, an external voltage noise induced equally among twoconductor of a differential transmission line will be ignored duringdifferential signal measurement, as the noise will have the samemagnitude and phase in the two conductors. The non-limitingconfigurations shown in the illustrative embodiment are examples of howto balance noise such that the noise will be ignored or rejected.

Pair-to-pair isolation is also needed when the differential transmissionlines go through non-planar structures. Non-planar structures arestructures in which power planes are not present, such as viaconnections or component pins. A considerable amount of space is neededto arrange a via or pin field when multiple signal pairs are involved.The need for such space arises from the need to provide sufficientseparation between pairs in all directions in order to minimize signalcoupling among pairs. This results in larger components than needed andinefficient utilization of card wiring resources, and large timingdifferences between the signals.

The illustrative embodiments, and their exemplary use in vias and pinarrangements, maximize the number of differential transmission lines perunit area, while maintaining the required pair-to-pair isolation level.This is achieved by using the common noise rejection properties ofdifferential signaling.

Thus, the illustrative embodiments minimize the space needed fordifferential transmission lines, thereby resulting in the more efficientuse of hardware and time. For example, be being able to place moredifferential transmission lines per unit area, smaller and lessexpensive components are needed. Also, more signals may be transmittedfor a given component size or a given amount of available card realestate.

The descriptions of the various embodiments of the present inventionhave been presented for purposes of illustration, but are not intendedto be exhaustive or limited to the embodiments disclosed. Manymodifications and variations will be apparent to those of ordinary skillin the art without departing from the scope and spirit of the invention.The terminology used herein was chosen to best explain the principles ofthe embodiment, the practical application or technical improvement overtechnologies found in the marketplace, or to enable others of ordinaryskill in the art to understand the embodiments disclosed herein.

Embodiments of the present invention can take the form of an entirelyhardware embodiment, an entirely software embodiment or an embodimentincluding both hardware and software elements. In an embodiment, thepresent invention is implemented in software, which includes but is notlimited to firmware, resident software, microcode, etc. Such a softwareembodiment may take the form of a circuit design modeling program ordiagnostic program.

Furthermore, the invention can take the form of a computer programproduct accessible from a computer-usable or computer-readable mediumproviding program code for use by or in connection with a computer orany instruction execution system. For the purposes of this description,a computer-usable or computer readable medium can be any apparatus thatmay include, store, communicate, propagate, or transport the program foruse by or in connection with the instruction execution system,apparatus, or device. The medium can be an electronic, magnetic,optical, electromagnetic, infrared, or semiconductor system (orapparatus or device) or a propagation medium. Examples of acomputer-readable medium include a semiconductor or solid state memory,magnetic tape, a removable computer diskette, a random access memory(RAM), a read-only memory (ROM), a rigid magnetic disk and an opticaldisk. Current examples of optical disks include compact disk-read onlymemory (CD-ROM), compact disk-read/write (CD-R/W) and DVD.

A data processing system suitable for storing and/or executing programcode may include at least one processor coupled directly or indirectlyto memory elements through a system bus. The memory elements can includelocal memory employed during actual execution of the program code, bulkstorage, and cache memories which provide temporary storage of at leastsome program code to reduce the number of times code is retrieved frombulk storage during execution. Input/output or I/O devices (includingbut not limited to keyboards, displays, pointing devices, etc.) may becoupled to the system either directly or through intervening I/Ocontrollers.

Network adapters may also be coupled to the system to enable the dataprocessing system to become coupled to other data processing systems orremote printers or storage devices through intervening private or publicnetworks. Modems, cable modem and Ethernet cards are just a few of thecurrently available types of network adapters.

The present embodiment may be employed in or applied to a circuit asdescribed herein as part of the design for an integrated circuit chip.The chip design may be created in a graphical computer programminglanguage, and stored in a computer storage medium (such as a disk, tape,physical hard drive, or virtual hard drive such as in a storage accessnetwork). If the designer does not fabricate chips or thephotolithographic masks used to fabricate chips, the designer transmitsthe resulting design by physical means (e.g., by providing a copy of thestorage medium storing the design) or electronically (e.g., through theInternet) to such entities, directly or indirectly. The stored design isthen converted into the appropriate format (e.g., GDSII) for thefabrication of photolithographic masks, which typically include multiplecopies of the chip design in question that are to be formed on a wafer.The photolithographic masks are utilized to define areas of the wafer(and/or the layers thereon) to be etched or otherwise processed.

The resulting integrated circuit chips can be distributed by thefabricator in raw wafer form (that is, as a single wafer that hasmultiple unpackaged chips), as a bare die, or in a packaged form. In thelatter case the chip is mounted in a single chip package (such as aplastic carrier, with leads that are affixed to a motherboard or otherhigher level carrier) or in a multichip package (such as a ceramiccarrier that has either or both surface interconnections or buriedinterconnections). In any case the chip is then integrated with otherchips, discrete circuit elements, and/or other signal processing devicesas part of either (a) an intermediate product, such as a motherboard, or(b) an end product. The end product can be any product that includesintegrated circuit chips, ranging from toys and other low-endapplications to advanced computer products having a display, a keyboardor other input device, and a central processor.

The circuit or circuits may include, among other structures, lines andvias in printed circuit boards, packages, integrated circuits, cables,connectors or other devices.

Referring now to FIG. 7, a functional block diagram illustrating anetwork data processing system 700 in accordance with an embodiment ofthe present invention is shown. The system 700 may include servercomputers 702 and 704, client computers 706, 708, and 710, and a storageunit 714. The client computers 706, 708, and 710 may communicate withthe server computers 702 and 704 via a communications network 712(hereinafter “network”). Each of the client computers 706, 708, and 710may include a processor and a data storage device that is enabled tointerface with a user and communicate with one or more of the servercomputers 702 and 704. Each of the server computers 702 and 704 may alsoinclude a processor and a data storage device enabled to run, forexample, the circuit design modeling program or diagnostic program.

In an embodiment, the client computers 706, 708, and 710 may operate asan input device including a user interface while the circuit designmodeling program may run primarily one or more of the server computers702 and 704. It should be noted, however, that processing for thecircuit design modeling program may, in some instances be shared amongstthe client computers 706, 708, and 710 and the server computers 702 and704 in any ratio. In another embodiment, the circuit design modelingprogram may operate on more than one server computer, client computer,or some combination of server computers and client computers, forexample, a plurality of client computers (706, 708, 710) communicatingacross the network 712 with a single server computer.

In an embodiment, the client computers 706, 708, and 710 may be, forexample, personal computers or network computers. In the depictedexample, the server computers 702 and 704 provide data, such as bootfiles, operating system images, and applications to the client computers706, 708, and 710. The client computers 706, 708, and 710 may be clientsto the server computers 702 and 704 in the present example. The servercomputers 702 and 704, the client computers 706, 708, and 710, and thestorage unit 714 may be directly interconnected by differentialtransmission lines. The network data processing system 700 may includeadditional servers, clients, and other devices not shown.

The network 712 may include wired connections, wireless connections,fiber optic connections, or some combination thereof. In general, thenetwork 712 can be any combination of connections and protocols thatwill support communications between the client computers 706, 708, and710, and the server computers 702 and 704. The network 712 may includevarious types of networks, such as, for example, a local area network(LAN), a wide area network (WAN) such as the Internet, atelecommunication network, a wireless network, a public switched networkand/or a satellite network.

In various embodiments, the client computers 706, 708, and 710 may be,for example, a laptop computer, tablet computer, netbook computer,personal computer (PC), a desktop computer, a personal digital assistant(PDA), a smart phone, a mobile device, or any programmable electronicdevice capable of communicating with the server computers 702, and 704via the network 712. The client computers 706, 708, and 710 and theserver computers 702 and 704 may each include internal and externalcomponents, as described below with reference to FIG. 8.

In an embodiment, the system 700 may include any number of clientcomputers (706, 708, 710) and/or server computers (702, 704); however adiscrete number of each is shown for illustrative purposes only. It maybe appreciated that FIG. 7 provides only an illustration of oneimplementation and does not imply any limitations with regard to theenvironments in which different embodiments may be implemented. Manymodifications to the depicted environments may be made based on designand implementation requirements.

Referring now to FIG. 8, a block diagram of components of a computingdevice, such as the server computers 704 and 706 or the client computers706, 708 and 710, of the system 700 of FIG. 7, in accordance with anembodiment of the present invention is shown. It should be appreciatedthat FIG. 8 provides only an illustration of one implementation and doesnot imply any limitations with regard to the environments in whichdifferent embodiments may be implemented. Many modifications to thedepicted environment may be made.

The computing device may include one or more processors 802, one or morecomputer-readable RAMs 804, one or more computer-readable ROMs 806, oneor more computer readable storage media 808, device drivers 812, aread/write drive or interface 814, a network adapter or interface 816,all interconnected over a communications fabric 818. The communicationsfabric 818 may be implemented with any architecture designed for passingdata and/or control information between processors (such asmicroprocessors, communications and network processors, etc.), systemmemory, peripheral devices, and any other hardware components within asystem.

One or more operating systems 810, and one or more application programs811 are stored on the one or more of the computer readable storage media808 for execution by one or more of the processors 802 via one or moreof the respective RAMs 804 (which typically include cache memory). Inthe illustrated embodiment, each of the computer readable storage media808 may be a magnetic disk storage device of an internal hard drive,CD-ROM, DVD, memory stick, magnetic tape, magnetic disk, optical disk, asemiconductor storage device such as RAM, ROM, EPROM, flash memory orany other computer-readable tangible storage device that can store acomputer program and digital information.

The computing device may also include the R/W drive or interface 814 toread from and write to one or more portable computer readable storagemedia 826. Application programs 811 on the computing device may bestored on one or more of the portable computer readable storage media826, read via the respective R/W drive or interface 814 and loaded intothe respective computer readable storage media 808.

The computing device may also include the network adapter or interface816, such as a TCP/IP adapter card or wireless communication adapter(such as a 4G wireless communication adapter using OFDMA technology).Application programs 811 on the computing device may be downloaded tothe computing device from an external computer or external storagedevice via a network (for example, the Internet, a local area network orother wide area network or wireless network) and network adapter orinterface 816. From the network adapter or interface 816, the programsmay be loaded onto computer readable storage media 808. The network mayinclude copper wires, optical fibers, wireless transmission, routers,firewalls, switches, gateway computers and/or edge servers.

The computing device may also include a display screen 820, a keyboardor keypad 822, and a computer mouse or touchpad 824. The device drivers812 interface to the display screen 820 for imaging, to the keyboard orkeypad 822, to the computer mouse or touchpad 824, and/or to the displayscreen 820 for pressure sensing of alphanumeric character entry and userselections. The device drivers 812, R/W drive or interface 814 andnetwork adapter or interface 816 may include hardware and software(stored on computer readable storage media 808 and/or ROM 806).

The programs described herein are identified based upon the applicationfor which they are implemented in a specific embodiment of theinvention. However, it should be appreciated that any particular programnomenclature herein is used merely for convenience, and thus theinvention should not be limited to use solely in any specificapplication identified and/or implied by such nomenclature.

Based on the foregoing, a computer system, method, and computer programproduct have been disclosed. However, numerous modifications andsubstitutions can be made without deviating from the scope of thepresent invention. Therefore, the present invention has been disclosedby way of example and not limitation.

Now referring to FIG. 9 a block diagram of an exemplary design flow 900used, for example, in semiconductor IC logic design, simulation, test,layout, and manufacture, is shown. The design flow 900 includesprocesses, machines and/or mechanisms for processing design structuresor devices to generate logically or otherwise functionally equivalentrepresentations of the design structures and/or devices described aboveand shown in FIGS. 1-6. The design structures processed and/or generatedby the design flow 900 may be encoded on machine readable transmissionor storage media to include data and/or instructions that when executedor otherwise processed on a data processing system generate a logically,structurally, mechanically, or otherwise functionally equivalentrepresentation of hardware components, circuits, devices, or systems.Machines include, but are not limited to, any machine used in an ICdesign process, such as designing, manufacturing, or simulating acircuit, component, device, or system. For example, machines mayinclude: lithography machines, machines and/or equipment for generatingmasks (e.g. e beam writers), computers or equipment for simulatingdesign structures, any apparatus used in the manufacturing or testprocess, or any machines for programming functionally equivalentrepresentations of the design structures into any medium (e.g. a machinefor programming a programmable gate array).

The design flow 900 may vary depending on the type of representationbeing designed. For example, a design flow 900 for building anapplication specific IC (ASIC) may differ from a design flow 900 fordesigning a standard component or from a design flow 900 forinstantiating the design into a programmable array, for example aprogrammable gate array (PGA) or a field programmable gate array (FPGA)offered by Altera® Inc. or Xilinx® Inc.

FIG. 9 illustrates multiple such design structures including an inputdesign structure 920 that is preferably processed by a design process910. The design structure 920 may be a logical simulation designstructure generated and processed by the design process 910 to produce alogically equivalent functional representation of a hardware device. Thedesign structure 920 may also or alternatively comprise data and/orprogram instructions that when processed by the design process 910,generate a functional representation of the physical structure of ahardware device. Whether representing functional and/or structuraldesign features, the design structure 920 may be generated usingelectronic computer-aided design (ECAD) such as implemented by a coredeveloper/designer. When encoded on a machine-readable datatransmission, gate array, or storage medium, the design structure 920may be accessed and processed by one or more hardware and/or softwaremodules within the design process 910 to simulate or otherwisefunctionally represent an electronic component, circuit, electronic orlogic module, apparatus, device, or system such as those shown in FIGS.1-6. As such, the design structure 920 may comprise files or other datastructures including human and/or machine-readable source code, compiledstructures, and computer-executable code structures that when processedby a design or simulation data processing system, functionally simulateor otherwise represent circuits or other levels of hardware logicdesign. Such data structures may include hardware-description language(HDL) design entities or other data structures conforming to and/orcompatible with lower-level HDL design languages such as Verilog andVHDL, and/or higher level design languages such as C or C++.

The design process 910 preferably employs and incorporates hardwareand/or software modules for synthesizing, translating, or otherwiseprocessing a design/simulation functional equivalent of the components,circuits, devices, or logic structures shown in FIGS. 1-6 to generate aNetlist 980 which may contain design structures such as the designstructure 920. The Netlist 980 may include, for example, compiled orotherwise processed data structures representing a list of wires,discrete components, logic gates, control circuits, I/O devices, models,etc. that describes the connections to other elements and circuits in anintegrated circuit design. The Netlist 980 may be synthesized using aniterative process in which the Netlist 980 is resynthesized one or moretimes depending on design specifications and parameters for the device.As with other design structure types described herein, the Netlist 980may be recorded on a machine-readable data storage medium or programmedinto a programmable gate array. The medium may be a non-volatile storagemedium such as a magnetic or optical disk drive, a programmable gatearray, a compact flash, or other flash memory. Additionally, or in thealternative, the medium may be a system or cache memory, buffer space,or electrically or optically conductive devices and materials on whichdata packets may be transmitted and intermediately stored via theInternet, or other networking suitable means.

The design process 910 may include hardware and software modules forprocessing a variety of input data structure types including the Netlist980. Such data structure types may reside, for example, within libraryelements 930 and include a set of commonly used elements, circuits, anddevices, including models, layouts, and symbolic representations, for agiven manufacturing technology (e.g., different technology nodes, 32 nm,45 nm, 90 nm, etc.). The data structure types may further include designspecifications 940, characterization data 950, verification data 960,design rules 970, and test data files 985 which may include input testpatterns, output test results, and other testing information. The designprocess 910 may further include, for example, standard mechanical designprocesses such as stress analysis, thermal analysis, mechanical eventsimulation, process simulation for operations such as casting, molding,and die press forming, etc. One of ordinary skill in the art ofmechanical design can appreciate the extent of possible mechanicaldesign tools and applications used in the design process 910 withoutdeviating from the scope and spirit of the invention. The design process910 may also include modules for performing standard circuit designprocesses such as timing analysis, verification, design rule checking,place and route operations, etc.

The design process 910 employs and incorporates logic and physicaldesign tools such as HDL compilers and simulation model build tools toprocess the design structure 920 together with some or all of thedepicted supporting data structures along with any additional mechanicaldesign or data (if applicable), to generate a second design structure990. The second design structure 990 resides on a storage medium orprogrammable gate array in a data format used for the exchange of dataof mechanical devices and structures (e.g. information stored in a IGES,DXF, Parasolid XT, JT, DRG, or any other suitable format for storing orrendering such mechanical design structures). Similar to the designstructure 920, the second design structure 990 preferably comprises oneor more files, data structures, or other computer-encoded data orinstructions that reside on transmission or data storage media and thatwhen processed by an ECAD system generate a logically or otherwisefunctionally equivalent form of one or more of the embodiments of theinvention shown in FIGS. 1-6. In an embodiment, the second designstructure 990 may comprise a compiled, executable HDL simulation modelthat functionally simulates the devices shown in FIGS. 1-6.

The second design structure 990 may also employ a data format used forthe exchange of layout data of integrated circuits and/or symbolic dataformat (e.g. information stored in a GDSII (GDS2), GL1, OASIS, mapfiles, or any other suitable format for storing such design datastructures). The second design structure 990 may comprise informationsuch as, for example, symbolic data, map files, test data files, designcontent files, manufacturing data, layout parameters, wires, levels ofmetal, vias, shapes, data for routing through the manufacturing line,and any other data required by a manufacturer or otherdesigner/developer to produce a device or structure as described aboveand shown in FIGS. 1-6. The second design structure 990 may then proceedto a stage 995 where, for example, the second design structure 990:proceeds to tape-out, is released to manufacturing, is released to amask house, is sent to another design house, is sent back to thecustomer, etc.

1. An electronic device comprising: at least one layer forming a planeand having a plurality of interconnects passing through at least aportion of the layer; each of the plurality of interconnects having alongitudinal axis substantially perpendicular to the plane, theplurality of interconnects are orthogonally arranged in a grid patternand evenly spaced by a first distance, the plurality of interconnectscomprise: a first differentially driven signal conductor pair withconductors arranged next to each other in a first direction, the firstdirection is oriented diagonally relative to the orthogonal gridpattern; a second differentially driven signal conductor pair withconductors arranged next to each other in a second directionsubstantially perpendicular to the first direction, each conductor ofthe second differentially driven signal conductor pair is spaced by thefirst distance from each signal conductor of the first differentiallydriven signal conductor pair; and a third differentially driven signalconductor pair with conductors arranged next to each other in a thirddirection substantially parallel to the first direction, each conductorsof the third differentially driven signal conductor pair is spaced bythe first distance from one of the signal conductors of the seconddifferentially driven signal conductor pair.
 2. The electronic device ofclaim 1, wherein the plurality of interconnects further comprise: aplurality of ground conductors, wherein the plurality of interconnectscomprise a 3:1 ratio of signal conductors to ground conductors.
 3. Theelectronic device of claim 1, wherein the plurality of interconnectsfurther comprise: a plurality of ground conductors, wherein theplurality of signal conductors and the plurality of ground conductorsare arranged into rows and columns of the orthogonal grid pattern, eachrow of the orthogonal grid pattern includes a repeating pattern of threesignal elements and a single ground element, where successive sets ofthree signal elements are separated along the row by a single groundelement.
 4. The electronic device of claim 1, wherein the plurality ofinterconnects further comprise: a plurality of ground conductors,wherein the plurality of signal conductors and the plurality of groundconductors are arranged into rows and columns of the orthogonal gridpattern, each row of the orthogonal grid pattern includes a repeatingpattern of three signal elements and a single ground element, wheresuccessive sets of three signal elements are separated along the row bya single ground element, the repeating pattern of conductors in each rowis offset by one column and repeated in successive rows, creating threediagonal rows of signal elements followed by a single diagonal row ofground elements.
 5. The electronic device of claim 1, wherein theintegrated circuit device comprises an integrated circuit or a printedcircuit board.
 6. The electronic device of claim 1, wherein the firstdifferentially driven signal conductor pair, second differentiallydriven signal conductor pair, and third differentially driven signalconductor pair are arranged in a fully repeatable pattern repeatableeither an x direction or a y direction of the orthogonal grid pattern.7. The electronic device of claim 1, wherein the first differentiallydriven signal conductor pair, second differentially driven signalconductor pair, and third differentially driven signal conductor pairare arranged in a fully repeatable pattern repeatable in the firstdirection.
 8. The electronic device of claim 1, wherein the firstdifferentially driven signal conductor pair, second differentiallydriven signal conductor pair, and third differentially driven signalconductor pair are arranged in a fully repeatable pattern repeatable inthe second direction. 9-17. (canceled)
 18. An electronic devicecomprising: a plurality of signal elements and a plurality ofpower/ground elements evenly spaced by a first distance and orthogonallyarranged in a grid pattern, wherein the plurality of signal elements andthe plurality of power/ground elements are arranged into rows andcolumns of the orthogonal grid pattern, each row of the orthogonal gridpattern includes a repeating pattern of three signal elements and asingle ground element, where successive sets of three signal elementsare separated along the row by a single ground element, the repeatingpattern of conductors in each row is offset by one column and repeatedin successive rows, creating three diagonal rows of signal elementsfollowed by a single diagonal row of ground elements.
 19. The electronicdevice of claim 18, wherein the plurality of signal elements comprise aplurality of differentially driven pairs.
 20. The electronic device ofclaim 18, wherein the plurality of signal elements comprise: a firstdifferentially driven signal conductor pair comprising two of theplurality of signal elements arranged next to each other and spacedapart by a second distance in a first direction, the first direction isoriented diagonally relative to the orthogonal grid pattern; a seconddifferentially driven signal conductor pair comprising two of theplurality of signal elements arranged next to each other and spacedapart by the second distance in a second direction substantiallyperpendicular to the first direction, each signal element of the seconddifferentially driven signal conductor pair is spaced by the firstdistance from each signal element of the first differentially drivensignal conductor pair; and a third differentially driven signalconductor pair comprising two of the plurality of signal elementsarranged next to each other and spaced apart by the second distance in athird direction substantially parallel to the first direction, eachsignal element of the third differentially driven signal conductor pairis spaced by the first distance from one of the signal elements of thesecond differentially driven signal conductor pair.